GLOSSARY of Printed Circuits

Index to terms on this page:

CAD   CADCAM   CAE   CAF   CAGE    CAGE Code    CAM  
CAM files   candela    capacitive coupling   capacitors in parallel   capacitors in series   capture   card   card-edge-connector   CASON   CAT   cathode   CBGA   c'bore   CCA   CCGA   CCT   cd   CE   CEM   CEM-1   centroid   cermet   C4  
check plots   chip  
chip on board  
chip scale package   CI  
circuit design   CIM   ck   CLCC   clad   CM   CMC   CMOS   CNC   CNC drill   collapsing balls   collector   common   common mode   common mode current   common mode signal   CompactPCI   component  
component library   connection   connectivity   connector  
control code   Correlated Color Temperature   copper   copper foil   copper weight   core   COTS   coupling   coupon   c0g   COG   courtyard   courtyard excess  
courtyard manufacturing zone   CPLD   CPW   CRM   CS   CSP   CTE   CVS   Cyanate esters  

CAD — Computer Aided Design. A system where engineers create a design and see the proposed product in front of them on a graphics screen or in the form of a computer printout or plot. In electronics, the result would be a printed circuit layout.

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CADCAM — Simply a concatenation of the two terms CAD and CAM.

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CAE — Computer Assisted Engineering. In electronics work, CAE refers to schematic software packages.

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CAF — Conductive Anodic Filamentation (or Conductive Anodic Filament growth) - An electrical short which occurs in PCBs when a conductive filament forms in the laminate dielectric material between two adjacent conductors under an electrical bias. CAF is a potentially dangerous source of electrical failure in the PCB.  As PCB designs have increased in density, with hole-to-hole spacings reduced to 25 mils or less, CAF has become an everyday concern. [adapted from Erik J. Bergum, "CAF Resistance of NON-DICY FR-4," PC FAB , 9/2002]
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CAGE — Commercial and Government Entity.

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CAGE Code — Commercial and Government Entity Code. CAGE Code, is a unique identifier assigned to suppliers of various government or defense agencies, as well as to government agencies themselves. CAGE codes provide a standardized method of identifying a given facility at a specific location.

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CAM — Computer Aided Manufacturing.  (See CAM files )
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CAM files — CAM means Computer Aided Manufacturing. These are the data files used directly in the manufacture of printed wiring. . The types of CAM files are 1) Gerber file, which controls a photoplotter, 2) NC Drill file, which controls an NC Drill machine and 3) fab and assembly drawings in soft form (pen-plotter files). CAM files represent the valuable final product of PCB design. They are handed off to the board house which further refines and manipulates CAM data in their processes, for example in step- and-repeat panelization. Some PCB design software companies refer to all plotter or printer files as CAM files , although some of the plots may be check plots which are not used in manufacture.

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candela — [Photometry] Standard unit of luminous intensity is Candela (cd). See Luminous Intensity - Candlepower (USA) schorsch.com

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capacitive coupling — Capacitive coupling is the transfer of energy within an electrical network by means of displacement current (q.v.) between circuit nodes, induced by the electric field. See example of undesirable capacitve coupling above.

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capacitors in parallel — . "For capacitors connected in parallel the total capacitance is the sum of all the individual capacitances. When the capacitors are of similar construction, the total capacitance is equivalent to a capacitor with a plate area equal to the sum of all the individual plate areas. Capacitance is a direct function of plate area. Connecting capacitors in parallel effectively increases plate area and thereby increases total capacitance.The total capacitance of the circuit may by calculated using the formula:

Ct = C1 + C2 + C3 + ... Cn

where all capacitances are in the same units."
Cited Works:
"Capacitors in Series and Parallel." Repair and Maintenance Manuals - Integrated Publishing. Integrated Publishing, Inc., 2011. Web. 08 Nov. 2011. <CAPACITORS IN SERIES AND PARALLEL>.

Kuphaldt, Tony R., and Warren Young. "Simple Series Circuits." All About Circuits : Free Electric Circuits Textbooks. Ed. Jason Stark and Dennis Crunkilton. AllAboutCircuits.com, Aug. 2002. Web. 08 Nov. 2011. allaboutcircuits.com Chapter 5 - Series And Parallel Circuits.

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capacitors in series — The total capacitance of capacitors in series is less than the capacitance of any of the individual capacitors. The overall effect of connecting capacitors in series is to move the plates of the capacitors further apart. Because these plates are farther apart, the total value of the capacitance in the circuit is decreased.

All the values for capacitance in the formula should be in the same units. (All microfarads, all nanofarads or all picofarads; it doesn't matter as long as all the units are the same.)
Cited works:
"Capacitors in Series and Parallel." Repair and Maintenance Manuals - Integrated Publishing. Integrated Publishing, Inc., 2011. Web. 08 Nov. 2011. CAPACITORS IN SERIES AND PARALLEL.
Kuphaldt, Tony R., and Warren Young. "Series and Parallel Capacitors : CAPACITORS." All About Circuits : Free Electric Circuits Textbooks. Ed. Jason Stark and Dennis Crunkilton.
AllAboutCircuits.com, Aug. 2002. Web. 08 Nov. 2011. allaboutcircuits.com Series and Parallel Capacitors.

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capture — () v. 1.   To draw (schematics) with CAE software in such a way that data, especially connectivity, can be extracted electronically. The extracted data would minimally be a netlist and preferably also a BOM. The more useful the data that is included in the schematic, the more useful will be the BOM and netlist extracted from it will be.
2.   Extract data from a CAE schematic. E.g. " Capture a netlist."
n. The process of creating a CAE drawing containing intelligent data. E.G. "Schematic capture."
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card — another name for a printed circuit board.

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card-edge connector — A connector which is fabricated as an integral portion of a printed circuit board along part of its edge. Often employed to enable a daughter or add-on card to be plugged directly into another much larger printed board, the motherboard or backplane. See finger .

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CASON — Chip Array Small Outline No lead, a leadleass package used by Atmel that fits the same footprint as the 8-lead SOIC (EIAJ) package.

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CAT — Computer Aided Transceiver.

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cathode  — (KA-thohd) Pronunciation Key

1. noun [Electronics] In an electron tube the electrode through which a primary source of electrons enters the inter-electrode space. [Graf, Rudolf F. Modern Dictionary of Electronics. Newnes, 1999]
       
 
2. noun [Electronics] General name for any negative electrode. [Graf, Rudolf F. Modern Dictionary of Electronics. Newnes, 1999]
       
 
3. noun [Electronics] When a semiconductor diode is biased in the forward direction, that terminal of the diode which is negative with respect to the other terminal. [Graf, Rudolf F. Modern Dictionary of Electronics. Newnes, 1999]
 
4. noun [PCB Manufacturing] In electrolytic plating, the workpiece being plated. [Graf, Rudolf F. Modern Dictionary of Electronics. Newnes, 1999]

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CBGA — Ceramic Ball Grid Array.

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c'bore — [Mechanical Engineering - drawings] A cylindrically enlarged end of a hole. Typically used to accept the head of a socket head cap screw, making the screw head accessible but not obstructive. Counterbore (C'bore)

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CCA — Circuit Card Assembly. DoD.

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CCGA — Ceramic Column Grid Array. According to Microsemi, "CCGA packages will continue to be the high-reliability and high-density package solution of choice for space applications." Covered in full by Microsemi document AC190: Ceramic Column Grid Array Application Note

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CCT — [Photometry] Correlated Color Temperature

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cd — [Photometry] Abbreviation for Candela unit. Luminous Intensity - Candlepower (USA) schorsch.com

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CE — Chip Enable, a pin function name used in serial interfaces and etc.

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CEM — Contract Electronics Manufacturer, which especially means a contract manufacturer who is an assembly house. They stuff and solder parts onto printed circuit boards. The category CEM also includes cable assemblers, cabinet or enclosure assemblers, turnkey services, etc. They will most likely include testing as part of their service.

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CEM-1 — A NEMA grade of industrial laminate having a substrate of woven glass surfaces over a cellulose paper core and a resin binder of epoxy. It has good electrical and mechanical properties, somewhat surpassed by those of FR-4.
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centroid — The geometric center of a two-dimensional shape. For an rectangle, the centroid is the intersection of two diagonals drawn from the corners. Protter & Morrey, Jr. (1970, p. 521) has a good definition: In mathematics and physics, the centroid or geometric center of a plane figure is the arithmetic mean position of all the points in the figure. Informally, it is the point at which a cutout of the shape could be perfectly balanced on the tip of a pin.

For a complex shape, finding the centroid can be a daunting problem. Wikipedia has this covered.

Altium Designer will set a center of a part automatically, based on its pads only, not its body. This is what is meant by geometric centroid when speaking of PCB design. Setting an origin at the geometric centroid while building the footprint is a good idea. This component placed on the PCB can be rotated in place by editing its rotation property. With its origin at its center, it doesn't have to be nugded laterally to maintain its original position.

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cermet — A composite material composed of

cer

amic and

met

al materials, used as the resistive material in pots and also in non-electrical applications such as saw and tubine blades.

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C4 — Controlled Collapsed Chip Connect. A type of flip-chip technology which is used in Intel's Pentium III™ and in Motorola's PowerPC 603™ and PowerPC 604™ RISC Microprocessors. Here is an Friday, February 07, 2003 introduction to the C4/CBGA interconnect technology by Kromann, Gerke and Huang of Motorola's Advanced Packaging Technology Division.

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check plots — Pen plots that are suitable for checking only. Pads are represented as circles and thick traces as rectangular outlines instead of filled-in artwork. This technique is used to enhance transparency of multiple layers.

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chip — 1. An integrated circuit manufactured on a semiconductor substrate and then cut or etched away from the silicon wafer.  (Also called a die.) A chip is not ready for use until packaged and provided with external connections.  2.   Commonly used to mean a packaged semiconductor device.

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chip on board — Abbreviated COB.  In this technology integrated circuits , small portions of silicon wafers, are glued and wire-bonded directly to printed circuit boards instead of first being packaged. The electronics for many mass-produced toys are embedded by this system, which can be identified by the black glob of plastic sitting on the board. Underneath that glob (technical term: glob top ), is a chip with fine wires bonded to both it and the landing pads on the board.

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chip scale package — A chip package in which the total package size is no more than 20% greater than the size of the die within. Eg: Micro-BGA.

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CI — PCB Complexity Index

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circuit design — The creation of the functional description and diagram (the schematic) of an electronic circuit. Done by an electrical engineer, this is NOT the same thing as "printed circuit design."
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CIM — Computer Integrated Manufacturing. Used by an assembly house, this software inputs assembly data from a PCB CAM/CAD package, such as Gerber and BOM , as input and, using a pre-defined factory modeling system, outputs routing of components to machine programming points and assembly and inspection documentation.  In higher end systems, CIM can integrate multiple factories with customers and suppliers.

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ck — - abbreviation for circuit.

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CLCC — Ceramic Leadless Chip Carrier. This component package acronym describes the package material (ceramic rather than plastic) and the terminal style (leadless) and that it is chip. It says nothing about the form of the package, so it could be considered to describe a miscellaneous category of package. The manufacturer's datasheet must be consulted for complete dimensional information.

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clad — A copper object on a printed circuit board. Specifying certain text items for a board to be "in clad" means that the text should be made of copper, not silkscreen.
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CM — Contract Manufacturer. An electronic manufacturing services (EMS) provider, such as an assembly house or a board house.

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CMC — Common Mezzanine Card. See downloadable PDF file by IEEE Computer Society P1386/Draft 2.4a. Common Mezzanine Card (CMC) mechanical specification

See also PCI mezzanine card

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CMOS — Complementary Metal-Oxide-Semiconductor logic uses a combination of p-type and n-type metal-oxide-semiconductor field effect transistors (MOSFETs) to implement logic gates and other digital circuits found in computers, telecommunications and signal processing equipment.

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CNC — Computerized Numerical Control. See numerical control.

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CNC drill — Computerized Numeric Controlled drill machine. A machine used to drill the holes in a printed board at exact locations, which are specified in a data file. Also known as "NC drill."

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collapsing balls — BGA balls that decrease in height when reflow soldered. This normally applies to BGAs of 0.65 mm pitch and higher, where the land (pad) is smaller than the ball size to allow the ball to collapse around the sides of the land. This requires a non-solder mask-defined land where the solder mask must be larger than the land.

Contrast with non-collapsing balls.

Citation:
Hausherr, Tom. Blog: PCB Design Perfection Starts in the CAD Library Part 9, section en-titled "BGA Components," Jan 21, 2011. Mentor Graphics, A Siemens Business, 8005 Boeckman Rd, Wilsonville, OR 97070. (URL no longer available. Before being acquired by Siemens, Mentor Graphics granted John Walt Childers permission to use segments of Mr. Hausherr's blog.)

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collector —

1. An electrode in a transistor that collects electrons or holes.
2. In certain electron tubes, an electrode to which electrons or ions flow after they have completed their function.

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common —

1. A point that acts as the reference potential for several circuits--a ground. [Graf, Rudolf F. Modern Dictionary of Electronics. Newnes, 1999]
2. Belonging to or shared by two or more signals or circuits.

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common mode — Signals that are identical with respect to both amplitude and time. Also used to identify the respective parts of two signals that are identical with respect to both amplitude and time.
[Graf, Rudolf F. Modern Dictionary of Electronics. Newnes, 1999]

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common mode current — In-phase currents, identical with respect to both amplitude and time, flowing in the same direction on multiple conductors with respect to another reference is known as Common Mode (CM). This can cause unwanted conductive and radiative emissions. [Ron Brewer What is Differential and Common Mode Current? ]

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common mode signal —

1. The instantaneous algebraic average of two signals applied to a balanced circuit (i.e., two ungrounded inputs of a balanced amplifier), all signals referred to a common reference.
2. In an amplifier with a differential input, a signal (referred to ground) that appears at both inverting and noninverting inputs with the same phase, amplitude and frequency. Power-line hum is the most frequently encountered common-mode signal.

[Graf, Rudolf F. Modern Dictionary of Electronics. Newnes, 1999]
3. In-phase currents, signals that are identical with respect to both amplitude and time, flowing in the same direction on multiple conductors with respect to another reference is known as Common Mode (CM). Common mode signals can cause unwanted conductive and radiative emissions. Since the CM may be simultaneously on multiple circuits and on the ground reference, it is difficult to cure. When doing design, remember Ben Franklin’s old saying: “An ounce of prevention is worth a pound of cure!” [Ron Brewer What is Differential and Common Mode Current? ]

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CompactPCI — Historical: After the first sponsor ballot (April, 1995) a new bus architecture was introduced to the market that rapidly gained large market interest. CompactPCI transformed the PCI local bus into a backplane bus with a maximum of eight slots. CompactPCI board,backplane and subrack mechanics are the same as VME64x, except for the backplane connectors. All the board and subrack mechanics defined for the VME64x architecture applies directly to CompactPCI. VME64x provides 205 and CompactPCI provides 315 user defined I/O pins through the backplane. The PICMG (PCI Industrial Computers Manufacturers Group) is responsible for the promotion and maintenance of the CompactPCI specifications.
[P1386/Draft 2.4a21-Mar-01 sponsered by the Microprocessor & Microcomputer Standards Committee (MMSC) of the IEEE Computer Society]

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component — Any of the basic parts used in building electronic equipment, such as a resistor, capacitor, DIP or connector, etc.

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component library — A representation of components as decals, stored in a computer data file which can be accessed by a PCB CAD program.

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connection — One leg of a net. Also called a "pin pair" (PADS) and "from-to" (Protel).

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connectivity — The intelligence inherent in PCB CAD software which maintains the correct connections between pins of components as defined by the schematic.

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connector — A plug or receptacle which can be easily joined to or separated from its mate. Multiple-contact connectors join two or more conductors with others in one mechanical assembly.

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control code — A non-printing character which is input or output to cause some special action rather than to appear as part of the data. Control codes are generated by holding down the <Ctrl> key on your computer keyboard while pressing one of the letter keys (e.g. < CTRL-G>. Sometimes called "control characters."
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Correlated Color Temperature — [Photometry] Color temperature is a simplified way to characterize the spectral properties of a light source. While in reality the color of light is determined by how much each point on the spectral curve contributes to its output, the result can still be summarized on a linear scale.
This value is useful eg. for determining the correct film in photography depending on the lighting (resp. for determining the white balance in digital photography), and for specifying the right light source types in architectural lighting design. Note, however, that light sources of the same color (metamers) can vary widely in the quality of light emitted. One may have a continuous spectrum, while the other just emits light in a few narrow bands of the spectrum. A useful way to determine the quality of a light source is its color rendering index.
Low color temperature implies warmer (more yellow/red) light while high color temperature implies a colder (more blue) light. Daylight has a rather low color temperature near dawn, and a higher one during the day. Therefore it can be useful to install an electrical lighting system that can supply cooler light to supplement daylight when needed, and fill in with warmer light at night. This also correlates with human feelings towards the warm colors of light coming from candles or an open fireplace at night.
Standard unit for color temperature is Kelvin (K).
(The kelvin unit is the basis of all temperature measurement, starting with 0 K (= -273.16° C) at the absolute zero temperature. The "size" of one kelvin is the same as that of one degree Celsius, and is defined as the fraction 1/273.16 of the thermodynamic temperature of the triple point of water, which positions 0° Celsius at 273.16 K.)
Technically, color temperature refers to the temperature to which one would have to heat a theoretical "black body" source to produce light of the same visual color.

Some typical color temperatures are:
1500 K	Candlelight
2680 K	40 W incandescent lamp
3000 K	200 W incandescent lamp
3200 K	Sunrise/sunset
3400 K	Tungsten lamp
3400 K	1 hour from dusk/dawn
5000-4500 K	Xenon lamp/light arc
5500 K	Sunny daylight around noon
5500-5600 K	Electronic photo flash
6500-7500 K	Overcast sky
9000-12000 K	Blue sky

https://www.schorsch.com/en/kbase/glossary/cct.html cited 8/6/2011 Copyright © 2004-2011 schorsch.com

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copper — A red-orange metallic element ideally suited for the wires used in construction of telephone and power lines, due to its strength and ductility and its pronounced ability to conduct electricity. It is also the most common conductor used as printed wires on or in printed circuit boards. Copper for construction of PCBs is provided in sheets called "foil."

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copper foil — A sheet of copper of various thicknesses used for a conductive layer in the construction of a PCB stack-up (q.v.).

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copper weight — (KAH-pər WAYT)  Pronunciation Key  noun  [PCB Manufacturing] Copper thickness, whether as foil or as a layer of copper on core, is often specified on a PCB by weight per unit area. Usually, the spec is in "ounces" which really means "ounces per square foot." (In slang use, the area unit is dropped.)
   IPC-D-316 "Design Guide for Microwave Circuit Boards Utilizing Soft Substrates" states, "Copper Weight: The mass of copper per unit area for a foil. The copper foil industry typically expresses weight in ounces per square foot (oz/ft²). A copper foil weight of 1 oz/ft² corresponds to a nominal 34 µm thickness." Some simple arithmetic yields this in Imperial units—"One-ounce copper" is nominally 1.34 mils thick.
   For a fixed-width trace (wire), the higher the copper weight: (1) The more current it can carry without increasing the temperature of the trace, (2) the lower the voltage drop and (3) the lower its characteristic impedance. Therefore any PCB designer must specify the copper weight and know that quantity for each layer early on when laying out a board.
   PCB manufacturers determine or alter copper weight for any board based on the materials they select from their stock, which they purchase from PWB materials suppliers. If they are to match impedance requirements, they would be adjusting their stackup accordingly.
   IPC_IPC-D-316_IPC_June_1995
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core — A material used in printed circuit manufacturing. It is composed of fiberglass cloth impregnated with resin and cured (by baking in an oven) and it has a sheet of copper on one or both sides. The particular type of resin is usually either epoxy or polyurethane. The fiberglass cloth with cured resin is called "dielectric." The printed circuit manufacturer, or "board house," receives the core in its already-cured state in various thicknesses. The board house uses it along with other materials (foil and prepreg) to make a layer stack-up for a PCB.

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COTS — (KAHTS)  Pronunciation Key  noun  [Manufacturing] Commercially-available Off-the-Shelf.
Where applicable, use of COTS assemblies frees up time for designers to focus on the more unique aspects of their final product. Originally a military acronym, COTS is now a term widely used in manufacturing.

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coupling — [PCB electronics - note that the definitions for electrical phenomena herein are not broad in scope--they have been narrowed down to the field of PCB design in order for the PCB designer to be able to put them to use to get improved results.] Coupling, is the transfer of electrical energy from one circuit element to another. There are many types of coupling (For a broad definition, see Wikipedia article "Coupling (electronics)." Coupling can be desirable or undesirable. In PCB design, one focuses more on undesirable coupling --how to reduce it or eliminate it. In this regard, there are two main types of undesirable coupling to be reduced--inductive coupling (q.v.) and capacitive coupling (q.v.).
Example of undesirable inductive coupling (aka "cross-coupling" or "cross-talk"): It would be undesirable for two traces on adjacent layers of a PCB to be in such close proximity over a long distance that the fields generated by their signals couple inductively. This disrupts, or adds noise to, each of the signals. This example of two superimposed traces on adjacent layers is known as "broadside coupling." Traces being laid out on adjacent layers, when they cross, should cross at right angles to prevent broadside coupling. In general, traces laid out on adjacent layers should have biases (see bias) at 90 degrees to each other.
Example of undesirable capacitive coupling: It would be undesirable for a return path (aka ground plane) of a high frequency (over 100 MHz) signal to not be fully continuous. Note that a signal on one layer will have a return path on the nearest copper plane on an adjacent layer, and the return signal will follow back as near the path of the signal as is possible. Having this copper plane broken would result in the electromagnetic energy in the return path of a high frequency signal jumping over the gap by means of capacitive coupling. This creates unwanted EMI. For low frequencies, the return path would follow the available copper trace or plane.

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coupon — See test coupon.
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c0g — (SEE-ZIR-oh-GEE)  Pronunciation Key  modifier  [Components] C0G (Can be shown lower case to emphasize the 0 is zero, a number, not a letter.) C0G is an EIA code for a Class 1 ceramic capacitor. C0G is the highest quality and most popular of Class 1 ceramic capacitors. The letters and number are not an acronym and not at all intuitive. They form a code for temperature range and capacitance drift.
See "Table I EIA Codes For Temperature Slope of Class 1 Ceramic Capacitors" at http://my.execpc.com/~endlr/ceramic.html From that table: C is the code for 0.0 significant figures in ppm/C; 0 is the code for a multiplier of -1; G is the code for tolerance in ppm/C of ±30. c0g has a temperature drift of 0.0±30 ppm/C (+25C to +85C) The letters are usually shown as upper case, but I used lower case here to help distinguish the 0 as an integer and not a letter.See also np0, which is its equivalent in an older industry Code.

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COG — (KAHG)  Pronunciation Key  noun  [Components] A misspelling of C0G (c0g).(C0G could be shown lower case to emphasize the 0 is zero, a number, not a letter.)

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courtyard — The smallest polygon area that provides a minimum electrical and mechanical clearance (courtyard excess) around the combined component body and land pattern boundaries.

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courtyard excess — The area between the polygon circumscribing the land pattern and the component, and the outer boundary of the courtyard. The courtyard excess may be different in the x-and y-direction.

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courtyard manufacturing zone — The area that provides a minimum electrical and mechanical clearance (courtyard excess) around the combined component body and land pattern boundaries, adjusted for the specific pick-and-place machinery to be used in assembly. It is represented graphically as a simple geometric shape somewhat larger than the physical dimensions of the component, including both its body and leads.

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CPLD — complex programmable logic device (CPLD) a programmable logic device with complexity between that of PALs and FPGAs, and architectural features of both.
https://en.wikipedia.org/wiki/Complex_programmable_logic_device

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CPW — Co-Planar Waveguide

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CRM — Customer relationship management (CRM) is a system for managing a company’s interactions with current and future customers. It often involves using technology to organize, automate, and synchronize sales, marketing, customer service, and technical support.

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CS — Chip Select, a net or pin function name used in digital circuits.

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CSP — Chip Scale Package or Chip Scale Packaging.

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CTE — Coefficient of Thermal Expansion.The linear dimensional change of a material per unit change in temperature. A typical epoxy/glass PCB has a CTE of 16-21 ppm/°C. The CTE of ceramic is 6-8 ppm/°C.

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CVS — Concurrent Versions System. (CVS) A cross-platform code management system originally based on RCS. CVS tracks all revisions to a file in an associated file with the same name as the original file but with the string ",v" (for version) appended to the filename. These files are stored in a (possibly centralised) repository. [FOLDOC]

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Cyanate esters — are chemical substances in which the hydrogen atom of the phenolic OH group is substituted by a cyanide group. The resulting product with an -OCN group is named a cyanate ester. Cyanate esters based on a bisphenol or novolac derivative are used in the production of resins.
[Chemistry and Technology of Cyanate Ester Resins, Ian Hamerton (Ed.) Blackie Academic and Professional: Glasgow, 1994]

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